06-Jul-2023
Post-chemical mechanical planarization (pCMP) cleaning is required to remove particles, residues, and contaminants from substrates without generating scratches, surface roughness, or corrosion.
We offer application-specific solutions for pCMP cleaning that provide excellent corrosion control, surface contamination removal, and cost of operational performance.
Our extensive portfolio includes industry-leading cleaning chemistries for the semiconductor industry, wide band gap semiconductor (WBGS) industry (substrates such as SiC, GaN, etc.) and for the hard disk drive (HDD) industry including nickel-phosphorus plated substrate and media, and glass substrate and media.